Off-axis electron holography of focused ion beam milled GaAs and Si p-n junctions

作者: D Cooper , A C Twitchett , I Farrer , D A Ritchie , R E Dunin-Borkowski

DOI: 10.1007/3-540-31915-8_44

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摘要: Si and GaAs p-n junctions have been characterised in the transmission electron microscope using off-axis holography. Focused ion beam milling was used to prepare parallel-sided membranes with thicknesses of 200–500 nm. Off-axis holograms were acquired at 200kV order assess effect specimen preparation on electrostatic potentials measured across junctions.

参考文章(7)
Y. Yabuuchi, A study of the damage on FIB-prepared TEM samples of AlxGa1-xAs Journal of Electron Microscopy. ,vol. 53, pp. 471- 477 ,(2004) , 10.1093/JMICRO/DFH062
M. Gajdardziska-Josifovska, M.R. McCartney, Elimination of thickness dependence from medium resolution electron holograms Ultramicroscopy. ,vol. 53, pp. 291- 296 ,(1994) , 10.1016/0304-3991(94)90041-8
M.R. McCartney, M. Gajdardziska-Josifovska, Absolute measurement of normalized thickness, t/λi, from off-axis electron holography Ultramicroscopy. ,vol. 53, pp. 283- 289 ,(1994) , 10.1016/0304-3991(94)90040-X
A. C. Twitchett, R. E. Dunin-Borkowski, P. A. Midgley, Quantitative electron holography of biased semiconductor devices. Physical Review Letters. ,vol. 88, pp. 238302- ,(2002) , 10.1103/PHYSREVLETT.88.238302
T. Malis, S. C. Cheng, R. F. Egerton, EELS Log-Ratio Technique for Specimen-Thickness Measurement in the TEM Journal of Electron Microscopy Technique. ,vol. 8, pp. 193- 200 ,(1988) , 10.1002/JEMT.1060080206
A. C. TWITCHETT, R. E. DUNIN-BORKOWSKI, R. J. HALLIFAX, R. F. BROOM, P. A. MIDGLEY, Off-axis electron holography of electrostatic potentials in unbiased and reverse biased focused ion beam milled semiconductor devices. Journal of Microscopy. ,vol. 214, pp. 287- 296 ,(2004) , 10.1111/J.0022-2720.2004.01328.X