Dependence of Cu/Sn and Cu/60Sn40Pb Solder Joint Strength on Diffusion Controlled Growth of Cu 3 Sn and Cu 6 Sn 5
作者： D. S. Dunn , T. F. Marinis , W. M. Sherry , C. J. Williams
DOI: 10.1557/PROC-40-129
关键词:
摘要: The growth of intermetallic compounds and the strength Cu/ Sn 60Sn40Pb butt joints were studied as a function isothermal aging. effects single-crystal (100), (110), (111) oriented copper on rates Cu 3 6 5 are characterized influence elevated temperature aging tensile analyzed. Substrate orientation appears to rate. Metallographic measurements showed that grew at rate proportional square root time. Tensile tests aged revealed more complex time dependence.
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