Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration

摘要: A model describing the maximum clock frequency (FMAX) distribution of a microprocessor is derived and compared with wafer sort data for recent 0.25-/spl mu/m microprocessor. The agrees closely measured in mean, variance, shape. Results demonstrate that within-die fluctuations primarily impact FMAX mean die-to-die determine majority variance. Employing rigorously device circuit models, parameter on future distributions forecast 180, 130, 100, 70, 50-nm technology generations. Model predictions reveal systematic impose largest performance degradation resulting from fluctuations. Assuming 3/spl sigma/ channel length deviation 20%, projections generation indicate essentially gain can be lost due to Key insights this work elucidate recommendations manufacturing process controls targeted specifically toward sources fluctuations, development new design methodologies aimed at suppressing effect