Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

摘要: Advanced packaging technologies continue to enable the semiconductor industry meet needs for ever thinner, smaller and faster components required in mobile devices other high performance applications. In early days of advanced packaging, C4 solder bumps were alternative wire bonding. Although lead-free remains one preferred methods assembly, tall copper structures (copper pillars) are becoming standard interconnect solution many A process lithography subsequent electroplating mainstream today's pillar formation on wafer level high-end flip chip devices. The latest trends require another technology development when it comes pillars. Modern integration schemes such as 2.5D interposer well 3D stacking have pushed limits capabilities. Specifically, need fine-pitch aspect ratio pillars represents a cha...