Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon

摘要: A very large scale integrated (VLSI) chip designed to operate at 3.3 volts is modified be compatible with prior systems having a 5 volt voltage supply. central processing unit (CPU) fabricated center position on an circuit that has operating of volts. The soldered into pin grid array (PGA) package and heat sink attached the PGA above CPU. volt- to- regulator input output placed edge package. connected chip. VCC 5V board pins are VSS ground in common both terminal pads chip, High performance capacitors used improve transient response on-package regulator. Dual operation regulated achieved by making available