A novel high performance die attach

摘要: Au/In isothermal solidification technique was evaluated as an alternative method for high performance die attachment. Bonding could be achieved at temperatures between 250°C ‐ 3008C about five to ten seconds. The microstructures of the bonds were studied and their effects on reliability analysed. quality depends very much surface waviness substrate. For substrates, bonding successfully 3mm × dies, which is almost one order magnitude bigger than size achievable Au/Si eutectic bonding, show no obvious degradation after 2,800 cycles –55°C 125°C.