Promising electroplating solution for facile fabrication of Cu quantum point contacts

摘要: In this article, we report on the fabrication and transport measurements of Cu quantum point contacts prepared by a novel, electrochemically assisted mechanically controllable break junction (EC-MCBJ) method. By employing photolithography wet-etching processes, suspended electrode pairs were patterned fabricated successfully Si microchips. Rather than adopting an acid electroplating solution, novel alkaline solution was developed utilized to establish nanocontacts between pairs. Typically, widths as-fabricated found be smaller 18 nm. A large number then produced characterized home-built MCBJ setup. addition conventional histogram, where peaks tend decrease in amplitude with increasing conductance, anomalous type conductance exhibiting different peak amplitudes, observed. Through statistical analysis maximum allowable bending microchips, theoretical calculations, demonstrated that our affords are compatible subsequent operations, which is essential for contacts. As sophisticated e-beam lithography not required, EC-MCBJ method fast, simple, cost-effective. Moreover, it likely suitable characterization various metals from their respective solutions.