作者: S.W. Choi , Y.M. Kim , K.M. Lee , H.S. Cho , S.K. Hong
DOI: 10.1016/J.JALLCOM.2014.08.033
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摘要: Abstract The microstructure of the Al–9.7Si–0.7Cu–0.4Mg alloy solidified by different cooling rates was reported in this study and solution heat treatment followed aging carried out for effects on mechanical thermal characteristics. performed at 535 °C 6 h then specimens were cooled water quenching. samples aged 180 °C or 190 °C 1–10 h. By treatment, long needles eutectic silicon particles broken down into smaller fragments gradually spheroidized. Spheroidizing has found to improve tensile strength diffusivity alloy. In particular, as increasing temperature Al–Si–Cu–Mg from 190 °C, 3% higher conductivity achieved.