Polishing technique to minimize abrasive removal of material and composition therefor
作者： John Flake , Janos Farkas , Johannes Groschopf , Yuri Solomentsev , Jennifer Cooper
DOI:
关键词:
摘要: The present invention provides a composition and method of polishing surface that minimizes abrasive removal material from the surface. To end, is formulated to maximize dissolution
lens.org 参考文章(14)
Rajeev Bajaj, Jaime A. Saravia, Chelsea Dang, Jason Gomez, David Watts, Melissa Freeman, Lance B. Cook, Janos Farkas, Sanjit Das, Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture ,(1997)
Noriyuki Sakuma, Seiichi Kondo, Yoshio Homma, Methods of polishing, interconnect-fabrication, and producing semiconductor devices ,(2001)
Li Yao, Robert J. Small, Abrasive-free chemical mechanical polishing composition and polishing process containing same ,(2003)
Venkat Kolagunta, Brian G. Anthony, Suresh Venkatesan, Rajesh Tiwari, Janos Farkas, John Mendonca, Mohammed Rabiul Islam, Abbas Guvenilir, Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process ,(2001)
Fred C. Redeker, Rajeev Bajaj, Jui-Lung Li, Yuchun Wang, Additives for pressure sensitive polishing compositions ,(2001)
Yongqi Hu, Stan D. Tsai, Liang-Yuh Chen, Feng Q. Liu, Alain Duboust, Siew S. Neo, Yan Wang, Method and composition for polishing a substrate ,(2006)
Maria Louise Peterson, David John Maloney, Laurence Mcghee, Robert J. Small, Chemical mechanical polishing composition and process ,(1997)
Noriyuki Sakuma, Toshinori Imai, Naofumi Ohashi, Yoshio Homma, Apparatus and method for producing substrate with electrical wire thereon ,(2002)
Noriyuki Sakuma, Seiichi Kondo, Yoshio Homma, Method of polishing ,(2000)