Facilitating low-temperature diffusion bonding between oxygen-free Al2O3 ceramic and pure Cu through inclusion of 0.8 La (wt.%) to Ti pre-metallized interlayer: Microstructural evolution, metallurgical reactions, and mechanical properties
作者： Chun-Ming Lin , Tseng-Pei Hsins
DOI: 10.1016/J.SURFIN.2020.100738
关键词:
摘要: … O 3 ceramics and necessitated the development of low-temperature active filler metals to facilitate the bonding of ceramics to metals. Ti, Zr, and Hf-based … Active metal brazing of zirconia …
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