Analysis of microwave capacitors and IC packages
作者： B. Beker , G. Cokkinides , A. Templeton
DOI: 10.1109/22.310585
关键词:
摘要: This paper presents quasi-static electromagnetic (EM) models for analysis and design of microwave capacitors integrated circuit (IC) packages. The theoretical background modeling open 3-D boundaries with finite difference method (FDM) is reviewed the use current simulation (CSM) inductance computation proposed. Computed data capacitance complex three-dimensional geometries are verified both numerically experimentally, validating proposed models. Numerical results practical devices IC packages also given. >
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