作者: R. Jones , R. J. Callinan
DOI: 10.1080/03601218008907356
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摘要: Abstract In the reinforcing of structures or patching cracks with a bonded overlay high strength composite material, thermal mismatch between patch and underlying material is often thought to be major problem. This paper shows that temperature fields used in repair process together support conditions cause significant lowering effective coefficient expansion structure which being repaired, turn results low values for residual stresses.