High-frequency circuit device and radar
作者： Hiromichi Watanabe , Shinichi Sugiura , Takashi Yonemoto
DOI:
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摘要: A semiconductor chip is provided with a high-frequency circuit. multi-layer wiring section comprised of organic material and formed on the chip, an outermost layer bump forming portion. The reinforcing means for suppressing deformation bonding portion between when circuit device bonded to substrate ultrasonic vibration applied thereto.
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