SEMICONDUCTOR MANUFACTURING APPARATUS
作者： Honbori Isao , Kisakibaru Toshiro , Ueno Kouta , Sugiyama Satoki
DOI:
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摘要: Provided is a semiconductor manufacturing apparatus that can easily prevent moisture adhesion to wafer surface inside an EFEM. A 1 provided with: process device 30 for processing wafers 90; FOUP 40 supplying the 90, and accommodating those 90 which has concluded; EFEM 10 transferring between 30; fan filter unit 20 sending airflow 72 from above 10; ultrasonic wave oscillator 52 generating high-frequency power; vibrator 54 waves 80 power generated by 52, directing onto concluded, conveyed 10.
lens.org 参考文章(6)
Kang-Hee Lee, Seung-yeon Lee, Seon-Ah Jin, Jun-Ho Lee, Method and apparatus for removing organic materials ,(2013)
Cho Chang-Min, Kim Hyeog-Ki, Lee Ok-Sun, Kim Ki-Doo, Ri Kenko, SUBSTRATE TRANSFER CONTAINER, DEVICE, AND METHOD ,(2005)
Okuyama Kikuo, Fujii Toshiaki, Shimada Manabu, SOLID SURFACE PURIFYING METHOD AND DEVICE THEREFOR ,(1998)
Yamazaki Katsuhiro, HERMETICALLY SEALED CONTAINER AND SEMICONDUCTOR MANUFACTURING APPARATUS ,(2012)
Shigaraki Toshiyuki, WAFER CHUCK HAVING CLEANING FUNCTION, AND CLEANING METHOD THEREFOR ,(2000)
Okuyama Kikuo, Moriya Takeshi, Nakayama Hiroyuki, Shimada Manabu, SUBSTRATE TRANSFER MECHANISM, SUBSTRATE TRANSFER EQUIPMENT INCLUDING THE SAME, PARTICLES REMOVING METHOD FOR SUBSTRATE TRANSFER MECHANISM, PARTICLES REMOVING METHOD FOR SUBSTRATE TRANSFER EQUIPMENT, PROGRAM FOR EXECUTING ITS METHOD, AND STORAGE MEDIUM ,(2005)