Investigation and Experimental Analysis of Diffusion Bonding of Al 6061/Sicp Materials
作者： V. Thirunavukkaasu, , J. Maniraj, , K. Kumaresan, , K. M. Senthil Kumar, , K. Kanthavel,
DOI: 10.1515/IJMSP.2009.10.3-4.213
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摘要:
sci-hub.se 参考文章(14)
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