Drying apparatus and method using IPA of a semiconductor wafer

摘要: When an IPA is fed to a nozzle, flow of the passing through holes generated. The becomes film-shaped and goes downward along inner surface side wall processing vessel. Then, collected by liquid receiving section formed in lower portion vessel discharged outside. covered with IPA. Therefore, vapor can be prevented from condensing uselessly on surface. As result, effectively utilized for condensation object processed which mounted pan. Thus, defective dryness prevented.