Creep Measurements of 200 μm - 400 μm Solder Joints

摘要: For the last decades, many mechanical measurements on solder alloys were carried out. As a matter of fact, microstructure materials is affected by their compositions. In addition, external variables like reflow cooling rate, volume, thermal mass package and pad metallization may have an influence. those reasons discrepancies creep contact specimen are larger than tensile samples. A motivation for measurement activities lifetime prediction electronic components, which joints electric-mechanical connection interposer or printed circuit board. Structure-mechanic simulation tools FEM can calculate interactions between assembled such complete packages. Often, weakest participants in whole assembly determine total lifetime. Nevertheless, every highly dependent material laws. Therefore, needs accurate fatigue model precise this solder. The paper presents new experimental design measuring behaviour area arrayed bumps different sizes various It focuses feasibility industrial manufactured FC, CSP BGA First accomplished with 200 μm 400 diameter. test setup works cyclic reversible shear force initiation into joints. operates temperature range T = [20...125]°C. High-resolution adjustment displacement enables steady state strain rate [10-2...10-8] 1/sec. Industrial demands introducing SnAgCu base solders required concentration high Sn-based alloys.