The Influence of Size and Composition on the Creep of SnAgCu Solder Joints
作者： S. Wiese , M. Roellig , M. Mueller , S. Rzepka , K. Nocke
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摘要: The paper presents creep data, that was gained on non eutectic SnAgCu-solder specimens with a variety of compositions. SnAgCu-alloys were tested in different specimen sizes: bulk specimens, FBGA solder balls, flip chip joints. results the experiments show both alloy composition and joint size have significant influence properties material. Bulk rectangular cross section 4mm times 3mm contained following alloys: Sn98Ag2, Sn97Ag3, Sn96Ag4, Sn97.5Ag2Cu0.5, Sn97.1Ag2Cu0.9, Sn98.8Ag2Cu1.2, Sn96.5Ag3Cu0.5, Sn96.1Ag3Cu0.9, Sn95.8Ag3Cul.2, Sn96.9Ag3Au0.1. balls three noneutectic alloys content 0.5% < Ag 4% 0.2% Cu 0.8%. Flip joints Sn96.5Ag3.5 an non-eutectic SnAg 3%. Creep been carried out temperature range between T = 5degC ... 150degC. microstructures various analysed to understand their differences behavior
sci-hub.se 参考文章(15)
S. Wiese, M. Roellig, K.-J. Wolter, Creep of eutectic SnAgCu in thermally treated solder joints electronic components and technology conference. pp. 1272- 1281 ,(2005) , 10.1109/ECTC.2005.1441433
M. Roellig, R. Dudek, S. Wiese, B. Wunderle, K.-J. Wolter, B. Michel, Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts international spring seminar on electronics technology. pp. 257- 264 ,(2005) , 10.1109/ISSE.2005.1491037
S. Wiese, F. Kramer, M. Krause, S. Bennemann, M. Muller, M. Rollig, M. Petzold, K.-J. Wolter, Compositional Effects on the Creep Properties of SnAgCu Solder EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. pp. 1- 6 ,(2006) , 10.1109/ESIME.2006.1644017
J. D. Parker, B. Wilshire, The Effect of a Dispersion of Cobalt Particles on High-Temperature Creep of Copper Metal science. ,vol. 9, pp. 248- 252 ,(1975) , 10.1179/030634575790445053
N. Nir, T. D. Dudderar, C. C. Wong, A. R. Storm, Fatigue Properties of Microelectronics Solder Joints Journal of Electronic Packaging. ,vol. 113, pp. 92- 101 ,(1991) , 10.1115/1.2905390
P. A. Kramer, J. Glazer, J. W. Morris, The effect of low gold concentrations on the creep of eutectic tin-lead joints Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 25, pp. 1249- 1257 ,(1994) , 10.1007/BF02652299
H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, M. Fine, Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders Journal of Electronic Materials. ,vol. 26, pp. 783- 790 ,(1997) , 10.1007/S11664-997-0252-Z
R.A. Stevens, P.E.J. Flewitt, The dependence of creep rate on microstructure in a γ′ strengthened superalloy Acta Metallurgica. ,vol. 29, pp. 867- 882 ,(1981) , 10.1016/0001-6160(81)90129-2
M. McLean, On the threshold stress for dislocation creep in particle strengthened alloys Acta Metallurgica. ,vol. 33, pp. 545- 556 ,(1985) , 10.1016/0001-6160(85)90018-5
Z. Mei, J. W. Morris, M. C. Shine, T. S. E. Summers, Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints Journal of Electronic Materials. ,vol. 20, pp. 599- 608 ,(1991) , 10.1007/BF02669524