The Effects of Test Condition, Microstructure and Linewidth on Electromigration Void Morphology
作者： S. Bauguess , M. L. Dreyer , M. Tucker , D. Theodore , C. T. Lee
DOI: 10.1557/PROC-391-379
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摘要: In this paper, experimental results for electromigration void morphology and failure time distribution are presented as a function of test condition, grain size conductor linewidth. Unpassivated Al-Cu(1.5%)-Si(1.5%) conductors with linewidths in the range lum ≤W ≤l0μm were subjected to accelerated temperature stresses T=150° C 250°C current j= 0.5-4X10 6 A-cm -2 , each stress. Unlike previous reports, erosion-like voids dominated at all densities temperatures both W/D 50 ≤1 > 1. The within line was strongly dependent on conditions critical density extracted from lifetimes measured density. show that linewidth dependence depend Blech relation.
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