作者: Hideki Sunayama , Kazutaka Yamada , Minoru Karasawa , Keiji Ishibashi
DOI: 10.1016/S0040-6090(03)00120-2
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摘要: Abstract Polycrystalline silicon (poly-Si) films have been deposited on low-temperature substrates using a hot-wall type catalytic chemical vapor deposition apparatus. Average grain size of the poly-Si was 10–20 nm. Hall mobility 2–5 cm 2 V −1 s obtained even for sample left at ambient conditions month. The influence sidewall temperature film properties has investigated. prepared under hot/cold-wall conditions. Comparing crystalline fractions both measured by Raman spectroscopy, difference small. 89 and 85% were hot- cold-wall conditions, respectively. As results attenuated total reflection Fourier-transform infrared distinct between two found, H O atoms more incorporated in than