The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages
作者： M. T. Sheen , Y. H. Ho , C. L. Wang , K. C. Hsieh , W. H. Cheng
DOI: 10.1007/S11664-005-0257-4
关键词:
摘要: The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser-diode packages after thermal-aging testing were studied experimentally numerically. Specimens aged at 150°C for up to 64 days. decreased as aging time increased. fracture surface the solder joints showed that decrease was caused by both enlargement initial voids an increase number Finite-element method (FEM) simulations good agreement with experimental measurements. Both numerical results indicate voids, stress concentration period increased, resulted weakness strength. effect temperature-cycling on power variation InP laser diodes using also studied. It shown operated stable condition 500 cycles.
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