Failure Mechanisms Associated With Lens Shape of High-Power LED Modules in Aging Test
作者： Yi-Cheng Hsu , Yu-Kuan Lin , Ming-Hung Chen , Chun-Chin Tsai , Jao-Hwa Kuang
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摘要: High-power light-emitting diode (LED) modules encapsulated with different lens shapes after a thermal-aging test were studied experimentally and numerically. Samples from manufacturers aged at 80degC, 100degC, 120degC under constant driving voltage of 3.2 V. The results showed that the LED hemispherical-shaped plastic exhibited better lifetime due to thermal dissipation than those cylindrical-or elliptical-shaped lenses. Results also optical power increased removing because degradation material decreased amount light. key module package-related failure modes identified as material. A finite-element method (FEM) simulation major principle stress distributions high-power dependent on aging temperature. Both experimental FEM simulated clearly indicated uniformly minimize effect along path chip is essential extend operating life modules.
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