On deviation from parabolic behaviour during transient liquid phase bonding

作者: O. A. Ojo , M. M. Abdelfatah

DOI: 10.1179/174328408X281958

关键词:

摘要: Transient liquid phase bonding of a nickel based superalloy was performed. Departure from the parabolic relationship between solid/liquid interface migration and holding time that is predicted by standard analytical models observed. The deviation suggested as an alternate phenomenon responsible for anomalous extension required to produce eutectic free joint with increase in temperature.

参考文章(14)
W. F. Gale, E. R. Wallach, Microstructural development in transient liquid-phase bonding Metallurgical Transactions A. ,vol. 22, pp. 2451- 2457 ,(1991) , 10.1007/BF02665011
K. Tokoro, N.P. Wikstrom, O.A. Ojo, M.C. Chaturvedi, Variation in diffusion-induced solidification rate of liquated Ni–Cr–B insert during TLP bonding of Waspaloy superalloy Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 477, pp. 311- 318 ,(2008) , 10.1016/J.MSEA.2007.05.069
Y. Zhou, W. F. Gale, T. H. North, Modelling of transient liquid phase bonding International Materials Reviews. ,vol. 40, pp. 181- 196 ,(1995) , 10.1179/IMR.1995.40.5.181
Isaac Tuah-Poku, M. Dollar, T.B. Massalski, A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 19, pp. 675- 686 ,(1988) , 10.1007/BF02649282
W. D. MacDonald, T. W. Eagar, Isothermal solidification kinetics of diffusion brazing Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 29, pp. 315- 325 ,(1998) , 10.1007/S11661-998-0183-1
M. B. Henderson, D. Arrell, R. Larsson, M. Heobel, G. Marchant, Nickel based superalloy welding practices for industrial gas turbine applications Science and Technology of Welding and Joining. ,vol. 9, pp. 13- 21 ,(2004) , 10.1179/136217104225017099
S.K. Tung, L.C. Lim, M.O. Lai, Solidification phenomena in nickel base brazes containing boron and silicon Scripta Materialia. ,vol. 34, pp. 763- 769 ,(1996) , 10.1016/1359-6462(95)00577-3
K. Ohsasa, T. Narita, T. Shinmura, Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal Journal of Phase Equilibria. ,vol. 20, pp. 199- 206 ,(1999) , 10.1361/105497199770335721