Microstructural development in transient liquid-phase bonding
作者： W. F. Gale , E. R. Wallach
DOI: 10.1007/BF02665011
关键词:
摘要: The applicability of conventional models of the transient liquid-phase (TLP) bonding process to the joining of nickel using ternary Ni-Si-B insert metals is considered in this article. It is …
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