Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane
作者： Dimitry G. Grabbe
DOI:
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摘要: An integrated circuit chip module assembly (10) is disclosed that electrically interconnects the bond pads of various chips (20) in to circuitry (42) on a thin film multilayer membrane (22). The includes heat sink (16) with back surfaces thermal engagement therewith. Contacts (40) are electrical (22) and accurately positioned by means nests (28) formed surface A contact pressure equalizer (12) engages only selected areas (98) opposite contacts urge (44) into raised (40). relatively large plate (70) having layer (74) soft rubber thereon. plurality rigid plates (78) so each respective (20). narrow strip (88) hard strips engage then bolted together (20), (88), (78), sandwiched between.
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