Gcib liner and hardmask removal process

作者: Terry Spooner , Shom Ponoth , John Fitzsimmons , Shyng-Tsong Chen

DOI:

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摘要: A method comprises depositing a dielectric film layer, hard mask and patterned photo resist layer on substrate. The further includes selectively etching the to form sub-lithographic features by reactive ion etch processing barrier metal copper layer. gas cluster beam (GCIB) processing.

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