Pseudo soldering examining and judging method for BGA and CSP type chip spherical welding spots

摘要: The invention relates to a pseudo soldering examining and judging method for BGA CSP type chip spherical welding spots. comprises steps of: preparing an X-ray fluoroscopic examination device with inclination irradiation function; opening door putting to-be-examined circuit board on carrier table; ray generation moving part the ray; setting parameters as follows: tube voltage be 90KV; current 110[mu]A; filter high pass 1; gamma value kept unchanged brightness 3296; contrast ratio 1447; angle of adjusted 30 degrees; after target is found, adjusting magnification times maximum; under inclined radiation, differentiating upper-lower disc imaging profile ball body profile. According invention, irreversible destructiveness caused by cross-section electron microscopic energy spectrum methods avoided; function nondestructive spots added; simple operate; judgment accuracy high.