IC package carrier

作者: Noriyuki Matsuoka

DOI:

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摘要: A carrier for an IC package having a plurality of leads projecting in parallel sidewise from at least two lateral side surfaces thereof comprises substrate including section accommodating the therein and grooves formed central surface supporting lower on bottoms when has been accommodated section. Also included is support detachably mounted position substrate, disengageably engaged another with comprising lead retaining bars which are disposed so as to engage upper against thereof.

参考文章(6)
Nobutoshi Abe, Jiro Kobayashi, Yukio Kakizaki, Container for holding substrate ,(1982)
Robert B. Luthi, Clair E. Williams, Carrier and test socket for leadless integrated circuit ,(1979)
Yoshinori Egawa, IC Package carrier ,(1984)