作者: N. Daldosso , L. Pavesi
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摘要: Speed and complexity of integrated circuits are more increasing as technology advances. The combination ever-increasing chip size decreasing feature size, however, has already raised its fundamental bottleneck in terms speed, packaging, fanout, power dissipation. Optical interconnects become essential. Till now, the reliability compatibility many optical interconnect systems quite far from a real system based on hybrid approaches which make fabrication difficult costly. In last years big research effort was aimed to render Si an active materials so that it can be turned electronic material photonic material.