Electrodeposition of high-tungsten W-Ni-Cu alloys. Impact of copper on deposition process and coating structure

摘要: Abstract A simple method of electrodeposition a new class materials – W-Ni-Cu alloys has been proposed. The mean tungsten content was higher than 20 at.% which is substantial increase compared to other reported in the literature values: 5–10 at.%. major influencing factors plating process were identified and examined. This allowed us settle conditions for deposition various materials. These ternary can be deposited from aqueous citrate solutions by employing appropriate ratio concentrations W, Ni Cu bath. galvanic bath used electroplating environmentally friendly low toxicity. deposits are metallic, uniform, shiny highly adhesive substrates. layers colour, depending on copper percentage, vary dark silvery bright silver-orange. Also, mechanical properties obtained properly adjusting composition therefore layer stoichiometry. internal structure investigated it found that size structurally organized regions circa 3–5 nm. material consists two phases: a) nanocrystaline similar cupronickel with decreased percentage W b) fully amorphous phase/matrix containing higher, value, W. did not exhibit preferred orientation [111] direction typical binary iron-group-metal electrodeposited alloys.