Protection of microelectronic devices during packaging

摘要: The present invention relates to a method of protecting microelectronic device during packaging, including the steps applying water-insoluble, protective coating sensitive area on device; performing at least one packaging step; and then substantially removing coating, preferably by dry plasma etching. can include released MEMS element. be disposed wafer. vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), vapor deposited organic material, cynoacrylate, carbon film, self-assembled monolayered perfluoropolyether, hexamethyldisilazane, perfluorodecanoic carboxylic acid, dioxide, silicate glass, combinations thereof. also device, including: providing having area; package; attaching electrically interconnecting from area.