Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates
作者： Asit Kumar Gain , Liangchi Zhang , Y. C. Chan
DOI: 10.1007/S10854-015-3325-4
关键词:
摘要: This paper investigates the influence of Al2O3 nanoparticles on morphology interfacial intermetallic compound (IMC) layer and material properties Sn–3.0Ag–0.5Cu (wt%) solders Cu Au/Ni-plated substrates. In solder/Cu substrate systems, an island-shaped Cu6Sn5 IMC was found to be adhered at interface in initial reaction stage. However, a very thin Cu3Sn also observed between after long time all solder joints. On other hand, ternary scallop-shaped (Cu, Ni)–Sn both plain Sn–Ag–Cu joints containing These thicknesses were increased with time. ball region, Ag3Sn, IMCs uniformly distributed β-Sn matrix types adding these appeared fine microstructure. Furthermore, elastic moduli shear strength composite exhibited consistently higher value than that by second phase dispersion strengthening mechanism. The fracture surface brittle mode smooth surface, while showed semi-ductile failure characteristics rough dimpled surfaces.
springer.com
sci-hub.se 参考文章(32)
Guang Zeng, Songbai Xue, Liang Zhang, Lili Gao, Recent advances on Sn–Cu solders with alloying elements: review Journal of Materials Science: Materials in Electronics. ,vol. 22, pp. 565- 578 ,(2011) , 10.1007/S10854-011-0291-3
Hiren R Kotadia, Philip D Howes, Samjid H Mannan, A review : On the development of low melting temperature Pb-free solders Microelectronics Reliability. ,vol. 54, pp. 1253- 1273 ,(2014) , 10.1016/J.MICROREL.2014.02.025
Yaowu Shi, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li, Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints Journal of Materials Science: Materials in Electronics. ,vol. 21, pp. 256- 261 ,(2010) , 10.1007/S10854-009-9902-7
Mrunali Sona, K. N. Prabhu, Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints Journal of Materials Science: Materials in Electronics. ,vol. 24, pp. 3149- 3169 ,(2013) , 10.1007/S10854-013-1240-0
S.Y. Chang, C.C. Jain, T.H. Chuang, L.P. Feng, L.C. Tsao, Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder Materials & Design. ,vol. 32, pp. 4720- 4727 ,(2011) , 10.1016/J.MATDES.2011.06.044
Tama Fouzder, Qingqian Li, Y. C. Chan, Daniel K. Chan, Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates Journal of Materials Science: Materials in Electronics. ,vol. 25, pp. 4012- 4023 ,(2014) , 10.1007/S10854-014-2123-8
Y.C. Chan, D. Yang, Failure mechanisms of solder interconnects under current stressing in advanced electronic packages Progress in Materials Science. ,vol. 55, pp. 428- 475 ,(2010) , 10.1016/J.PMATSCI.2010.01.001
Yu. Plevachuk, W. Hoyer, I. Kaban, M. Köhler, R. Novakovic, Experimental study of density, surface tension, and contact angle of Sn-Sb-based alloys for high temperature soldering Journal of Materials Science. ,vol. 45, pp. 2051- 2056 ,(2010) , 10.1007/S10853-009-4120-5
Asit Kumar Gain, Liangchi Zhang, Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn–8Zn–3Bi solder on OSP–Cu substrate Journal of Alloys and Compounds. ,vol. 617, pp. 779- 786 ,(2014) , 10.1016/J.JALLCOM.2014.08.076
Jie Chen, Jun Shen, Dong Min, Changfei Peng, Influence of minor Bi additions on the interfacial morphology between Sn–Zn–xBi solders and a Cu layer Journal of Materials Science: Materials in Electronics. ,vol. 20, pp. 1112- 1117 ,(2009) , 10.1007/S10854-008-9835-6