Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints
作者： Yaowu Shi , Jianping Liu , Zhidong Xia , Yongping Lei , Fu Guo
DOI: 10.1007/S10854-009-9902-7
关键词:
摘要: … strain for a SnPb-based composite solder reinforced with nano-sized Ag particles. The … eutectic SnPb solder joints during thermo-mechanical fatigue cycling [11]. Thus, the SnPb based …
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sci-hub.se 参考文章(17)
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