Nanosized samarium oxide (Sm2O3) particles suppressed the IMC phases and enhanced the shear strength of environmental-friendly Sn–Ag–Cu material
作者： Asit Kumar Gain , Liangchi Zhang
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sci-hub.se 参考文章(32)
Asit Kumar Gain, Liangchi Zhang, Y. C. Chan, Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates Journal of Materials Science: Materials in Electronics. ,vol. 26, pp. 7039- 7048 ,(2015) , 10.1007/S10854-015-3325-4
Asit Kumar Gain, Liangchi Zhang, Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder Journal of Materials Science: Materials in Electronics. ,vol. 27, pp. 781- 794 ,(2016) , 10.1007/S10854-015-3817-2
Asit Kumar Gain, YC Chan, Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite solders Microelectronics Reliability. ,vol. 54, pp. 945- 955 ,(2014) , 10.1016/J.MICROREL.2014.01.026
Hiren R Kotadia, Philip D Howes, Samjid H Mannan, A review : On the development of low melting temperature Pb-free solders Microelectronics Reliability. ,vol. 54, pp. 1253- 1273 ,(2014) , 10.1016/J.MICROREL.2014.02.025
H.T. Lee, Y.H. Lee, Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints ☆ Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 419, pp. 172- 180 ,(2006) , 10.1016/J.MSEA.2005.12.021
Emeka H. Amalu, Ndy N. Ekere, High temperature reliability of lead-free solder joints in a flip chip assembly Journal of Materials Processing Technology. ,vol. 212, pp. 471- 483 ,(2012) , 10.1016/J.JMATPROTEC.2011.10.011
Yaowu Shi, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li, Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints Journal of Materials Science: Materials in Electronics. ,vol. 21, pp. 256- 261 ,(2010) , 10.1007/S10854-009-9902-7
N Chawla, Thermomechanical behaviour of environmentally benign Pb-free solders International Materials Reviews. ,vol. 54, pp. 368- 384 ,(2009) , 10.1179/174328009X461069
Y.C. Chan, D. Yang, Failure mechanisms of solder interconnects under current stressing in advanced electronic packages Progress in Materials Science. ,vol. 55, pp. 428- 475 ,(2010) , 10.1016/J.PMATSCI.2010.01.001
K.N. Tu, Reliability challenges in 3D IC packaging technology Microelectronics Reliability. ,vol. 51, pp. 517- 523 ,(2011) , 10.1016/J.MICROREL.2010.09.031