SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要: PURPOSE:To improve the electrical, mechanical, thermal and chemical characteristics of a metal wiring, which is constitute using copper layer as its main conductive layer. CONSTITUTION:A formed on an insulating film 104 semiconductor substrate 101, constituted laminated film, consists titanium 106, nitride 107a, copper-titanium intermetallic compound 108b alloy 109a added with other trace elements, tungsten 111 covering surface this multilayer film. The by method wherein after films 107a are formed, these subjected to heat treatment. improves adhesion prevents from being oxidized corroded. By improving device having fine highly reliable extending over long period time, manufactured at high yield throughput.