Method of forming a recessed structure employing a reverse tone process

作者: Sidlgata V. Sreenivasan

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摘要: The present invention provides a method of forming recesses on substrate, the including substrate patterning layer having first features; trim etching features to define trimmed shape; and transferring an inverse shape into substrate.

参考文章(140)
Yoko Kuramitsu, Takahisa Namiki, Ei Yano, Koji Nozaki, Keiji Watanabe, Miwa Igarashi, Resist compositions for forming resist patterns ,(1998)
Stevenx R. Droes, Toivo T. Kodas, Mark J. Hampden-Smith, Plasma-Enhanced Chemical Vapor Deposition (PECVD) Springer, Dordrecht. pp. 579- 603 ,(1997) , 10.1007/978-94-009-0071-4_23
Douglas J. Resnick, Scott D. Hector, Unitary dual damascene process using imprint lithography ,(2004)
Thomas R. LaLiberte, Michael R. Gorman, Tooling with helical coils for structured surface articles ,(2001)