Integrated back-end integrated circuit manufacturing assembly
作者： Bo Soon Chang
DOI:
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摘要: An integrated back-end circuit (IC) manufacturing assembly is disclosed. In one embodiment, the present invention has a front-of-line portion comprising plurality of sub-stations for operating on first die-strips an in-line basis to produce second die-strips. The embodiment further comprises end-of-line coupled and die-strip components. also test testing finish tested addition, camera systems perform automated visual inspection dies maintain database that can be used reject management.
google.com.tr参考文章(44)
Ronald J. Barnett, Plasma enhanced wire bonder ,(2000)
Stephen Henry George, Dynamically configurable equipment integration architecture ,(1995)
Rachel S. Sidorovsky, Adrian Murphy, Bidyut Sen, Michael J. Steidl, Jon M. Long, Semiconductor device package and method of making such a package ,(1990)
Bo Soon Chang, Vani Verma, Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process ,(2004)
Kevin D. Stoddard, Konstantinos Tsakalis, Bradley D. Schulze, Run-to-run controller for use in microelectronic fabrication ,(2000)
Dean Tarrant, Peter Davis, Method and apparatus for removing die from a wafer and conveying die to a pickup location ,(1999)
Eric Beyne, Steve Lerner, An image sensor ball grid array package and the fabrication thereof ,(2000)
Katsumi Kojima, Shin Nemoto, Hiroshi Okuda, Hisao Hayama, Automatic test handler system for IC tester ,(1996)
Qiaolin Jin, Yuehshian T. Chi, Parris C. M. Hawkins, Generic interface builder ,(2001)