作者: Hirofumi Miki , G Matsui , M Kanda , S Tsuchitani
DOI: 10.1088/0960-1317/25/3/035026
关键词:
摘要: The ability to pattern a thin film of poly(vinylidene fluoride) (PVDF), piezoelectric, pyroelectric and ferroelectric polymer, has potential applications in the fields microelectromechanical systems (MEMS), nonlinear optics nonvolatile random access memory technology. Low pressure O2 reactive ion etching (RIE) was employed realize fine pitch microstructures on β-phase PVDF (β-PVDF) for first time; line space (70/130 μm) microstructure array with height over 30 μm fabricated. Different traditional method PDMS molding, proposed technology did not result significant loss piezoelectricity. Furthermore, unlike x-ray photo-etching method, there no saturation limit method. Here, we introduce fabrication process detail report properties β-PVDF under different conditions. effect variables, such as supplied gas flow, applied RF power etch time, characteristics were investigated detail. time showed more predominant influence progress than flow. etched depth linearly increased amount power. Etching rates 10 h−1 achieved By means responding photomask design control conditions, much finer higher arrays are also possible.