A practical guide for the fabrication of microfluidic devices using glass and silicon

作者: Ciprian Iliescu , Hayden Taylor , Marioara Avram , Jianmin Miao , Sami Franssila

DOI: 10.1063/1.3689939

关键词:

摘要: … devices from glass and silicon. … glass and silicon and suggest a framework for selecting fabrication processes. We also describe key considerations for designing a glass and/or silicon …

参考文章(125)
Ciprian Iliescu, Guillaume Tresset, Guolin Xu, Dielectrophoretic field-flow method for separating particle populations in a chip with asymmetric electrodes. Biomicrofluidics. ,vol. 3, pp. 044104- ,(2009) , 10.1063/1.3251125
Lauri Sainiemi, Teemu Nissilä, Risto Kostiainen, Raimo A. Ketola, Sami Franssila, A microfabricated silicon platform with 60 microfluidic chips for rapid mass spectrometric analysis Lab on a Chip. ,vol. 11, pp. 3011- 3014 ,(2011) , 10.1039/C1LC20275H
M.M.R. Howlader, Satoru Suehara, Tadatomo Suga, Room temperature wafer level glass/glass bonding Sensors and Actuators A-physical. ,vol. 127, pp. 31- 36 ,(2006) , 10.1016/J.SNA.2005.11.003
J.H. Park, N.-E. Lee, Jaechan Lee, J.S. Park, H.D. Park, Deep dry etching of borosilicate glass using SF6 and SF6/Ar inductively coupled plasmas Microelectronic Engineering. ,vol. 82, pp. 119- 128 ,(2005) , 10.1016/J.MEE.2005.07.006
Ciprian Iliescu, Daniel P Poenar, Subramanian Tamil Selvan, Frequency dependence on the accuracy of electrical impedance spectroscopy measurements in microfluidic devices Journal of Micromechanics and Microengineering. ,vol. 20, pp. 022001- ,(2010) , 10.1088/0960-1317/20/2/022001
Masayoshi Esashi, Wafer level packaging of MEMS Journal of Micromechanics and Microengineering. ,vol. 18, pp. 073001- ,(2008) , 10.1088/0960-1317/18/7/073001
S. Metz, S. Jiguet, A. Bertsch, Ph. Renaud, Polyimide and SU-8 microfluidic devices manufactured by heat-depolymerizable sacrificial material technique Lab on a Chip. ,vol. 4, pp. 114- 120 ,(2004) , 10.1039/B310866J
A. W. Martinez, S. T. Phillips, G. M. Whitesides, Three-dimensional microfluidic devices fabricated in layered paper and tape. Proceedings of the National Academy of Sciences of the United States of America. ,vol. 105, pp. 19606- 19611 ,(2008) , 10.1073/PNAS.0810903105