Modelling intermetallic phase growth during high-power ultrasonic welding of copper and aluminum
作者： Jian Liu , Biao Cao , Jingwei Yang
DOI: 10.1016/J.JMAPRO.2018.09.008
关键词:
摘要: Abstract An analytical model was developed to understand the rapid growth mechanism of intermetallic compounds (IMC) interlayer in high-power ultrasonic welding process. The analytic solution derived for relationships among time, interface temperature and vacancy concentration. effectiveness this tested by comparing predicted thickness with experimental value copper aluminium at various amplitudes. consistency comparison demonstrates accuracy has been improved considering dynamic change process Besides, effects vibration amplitude resistance heat on increasing have investigated independently. results show that additional source could significantly promote welding.
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