作者: Zdenek Vykydal , Jan Visschers , Deniz Sabuncuoglu Tezcan , Koen De Munck , Tom Borgers
DOI: 10.1016/J.NIMA.2008.03.099
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摘要: Abstract The feasibility of using photon-counting imaging techniques with X-rays, neutrons or other types radiation for many applications in materials analysis and bio-medical sciences has already been well demonstrated. A hybrid imager consisting an appropriate sensor chip flip-chipped on top a Medipix2 readout ASIC is example such device. It can count single X-ray photons, without any noise dark current, at high fluxes (several Gigaphotons per cm2 second). limiting factors more widespread usage these devices (e.g. mammography small animal imaging) are the size active area (about 2 cm2 chip) low frame rate. aim RELAXd project (high REsolution Large Area Detector) to develop frame-rate, fully 3D-integrated microsystem, four chips bump-bonded one silicon forming basic building module. This paper presents first results this task focusing used wafer-level postprocessing technologies which needed achieve 3D architecture, required four-side tiling.