Multi-point probe

摘要: An object of the present invention is to provide a novel testing probe allowing electronic circuits smaller dimension as compared prior art technique. A particular advantage related fact that technique involving multi-point (12, 14, 16, 18) allows be utilised for establishing reliable contact between any pin or tip and specific location test sample, according includes individually bendable flexible pins (14, 18). feature relates may produced in process compatible with production circuits, measurement electronics integrated on probe, tests performed device fabricated by appropriate circuit technology planar technique, CMOS thick-film thin-film also LSI VLSI techniques.