作者: Takayama Masato , Hayashi Daisuke
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摘要: A processing system includes a thermo viewer 51 which measures temperature distribution over top surface of semiconductor wafer; measuring device 14 measures, for each divided areas the wafer, portion in area; median value calculating unit 202 calculates, area, based on measured by 51; an offset 204 difference between and as offset; control 205 controls, area such that becomes equal to set temperature, 14.