Multiple resonant frequency decoupling capacitor
作者： Daniel Douriet , Jorge M. Hernandez
DOI:
关键词:
摘要: A multiple resonant frequency decoupling capacitor is presented. The comprises a plurality of capacitive elements, each having different to define bandwidth for noise supression. One the elements indicative clock an integrated circuit being decoupled by capacitor. Further, at least one other element frequecny harmonic frequency.
lens.org 参考文章(13)
David A. Werdin, Reinhold Henke, Low RF emission fiber optic transmission system ,(1987)
Jorge M. Hernandez, Molded integrated circuit package incorporating thin decoupling capacitor ,(1990)
Jorge M. Hernandez, Aleta Gilderdale, Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages ,(1987)
Raymond C. Jodoin, Decoupled integrated circuit package ,(1984)
Rodney W. Larson, Jorge M. Hernandez, Decoupling capacitor and method of formation thereof ,(1987)
Jorge M. Hernandez, Aleta Gilderdale, Decoupling capacitor for pin grid array package ,(1986)
Reinhold Henke, High frequency noise bypassing ,(1988)
Jorge M. Hernandez, Low inductance decoupling capacitor ,(1989)
Vincent F Perna, Miniature feed-through wide band bypass capacitor assembly ,(1970)
Jorge M. Hernandez, Decoupling capacitor for surface mounted chip carrier ,(1985)