Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages

摘要: High frequency noise is decoupled from power supplied to Pin Grid Array (PGA), surface mounted leaded chip carrier and leadless packages by insertion of a decoupling capacitor between the PGA or package printed circuit board; mounting over package. The comprises multi layer capacitive element sandwiched pair conductors having plurality leads extending each conductor. In accordance with present invention, individually dimensioned configured fit under package, package; correspond ground pin lead configuration that PGA,