Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
作者： James Hayward , Candice H. Brown
DOI:
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摘要: An improved integrated circuit package is disclsoed which comprises a flexible lead frame assembly 2 having an die 60 mounted thereto. Lead first conductive metal layer 10 comprising leads 18 and 28 capable of being electrically connected to 60, dielectric 30 attached at least portion the 10, second 40 opposite side also one or more 48, 54, 56 die, layers further bus pattern 12 32 42 with 18, 28, 48 60. In preferred embodiment, each two 12, 22, for interconnecting respective pads 64 on
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