作者: Emad Samadiani , Yogendra Joshi , Farrokh Mistree
DOI: 10.1109/THETA.2007.363416
关键词:
摘要: In the near future, electronic cabinets of data centers will house high performance chips with heat fluxes approaching 100 W/cm and associated volumetric generation rates. With power trends in indicating 60 kW current cooling systems be insufficient new solutions need to explored. Accordingly, key issue that merits investigation is identifying satisfying needed specifications thermal solutions, considering design environment next centers. Anchoring our work open engineering paradigm, authors identify requirements future explore various an ideally solution for a center. To approach system centers, concept centered on multi-scale (multilevel) nature discussed. The potential this open, along its theoretical advantages compared typical air demonstrated through some scenarios. realization problems research needs are highlighted achieve practical Such believed most effective efficient