Introduction to Data Center Energy Flow and Thermal Management

作者: Yogendra Joshi , Pramod Kumar

DOI: 10.1007/978-1-4419-7124-1_1

关键词:

摘要: This chapter provides an introduction to the emerging trends in growth of data centers. It is seen that projected functionality and performance information technology communications equipment resulting sharply increasing power dissipation per unit facility footprint. Increased energy usage for powering thermal management centers, which a potential concern continued centers examined. The guidelines environmental control assure satisfactory are discussed. Thermal involves multiple length scales. approaches currently use under exploration at various scales presented. modeling also Data generally expected operate continuously, yet there have been documented failure events lead interruption. tier classification based on redundancy introduced.

参考文章(36)
Ankit Somani, Advanced thermal management strategies for energy-efficient data centers Georgia Institute of Technology. ,(2009)
Emad Samadiani, Yogendra Joshi, Farrokh Mistree, The Thermal Design of a Next Generation Data Center: A Conceptual Exposition 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application. pp. 93- 102 ,(2007) , 10.1109/THETA.2007.363416
William Tschudi, Tengfang Xu, Dale Sartor, Jay Stein, High-performance data centers: A research roadmap Other Information: PBD: 30 Mar 2004. ,(2004) , 10.2172/838173
J. Moore, J.S. Chase, P. Ranganathan, Weatherman: Automated, Online and Predictive Thermal Mapping and Management for Data Centers international conference on autonomic computing. ,vol. 43, pp. 155- 164 ,(2006) , 10.1109/ICAC.2006.1662394
Z. A. Williams, J. A. Roux, Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers Journal of Electronic Packaging. ,vol. 128, pp. 456- 465 ,(2006) , 10.1115/1.2353282
Srujan Gondipalli, Bahgat Sammakia, Siddarth Bhopte, Roger Schmidt, Madhusudan K. Iyengar, Bruce Murray, Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits ASME 2009 InterPACK Conference, Volume 2. pp. 841- 850 ,(2009) , 10.1115/INTERPACK2009-89203
Jeffrey Rambo, Yogendra Joshi, Modeling of data center airflow and heat transfer: State of the art and future trends Distributed and Parallel Databases. ,vol. 21, pp. 193- 225 ,(2007) , 10.1007/S10619-006-7007-3
Veerendra Mulay, Dereje Agonafer, Gary Irwin, Darshan Patell, Effective Thermal Management of Data Centers Using Efficient Cabinet Designs ASME 2009 InterPACK Conference, Volume 2. pp. 993- 999 ,(2009) , 10.1115/INTERPACK2009-89351
Roger Schmidt, Richard C. Chu, Mike Ellsworth, Madhu Iyengar, Don Porter, Vinod Kamath, Bret Lehman, Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger Advances in Electronic Packaging, Parts A, B, and C. pp. 663- 673 ,(2005) , 10.1115/IPACK2005-73468