Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching

摘要: As part of an effort to develop a micro gas turbine engine capable providing 10-50 W electrical power in package less than one cubic centimeter volume, we report the fabrication and testing first hydrogen combustor micromachined from silicon. Measuring 0.066 cm/sup 3/ complete with fuel manifold set injector holes, device was largely enabled by use deep reactive ion etching (DRIE) aligned silicon wafer bonding. The 150-W microcombustor has density excess 2000 MW/m/sup been successfully demonstrated provide inlet temperatures up 1800 K. After 15 h experimental tests, maintained its mechanical integrity did not exhibit any visible damage. Combined results materials oxidation study, these tests are used demonstrate satisfactory performance harsh oxidizing environment combustion chamber.