Highly compliant plate for wafer bonding
作者： Mauro Kobrinsky , Scott List , Shriram Ramanathan
DOI:
关键词:
摘要: The present invention discloses a method that includes: providing two wafers; forming raised contacts on the aligning bringing together contacts; locally deflecting and bonding contacts. also bonded-wafer structure first wafer, wafer being deflected, including contact; second contact, wherein contact is bonded to contact.
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